United Microelectronics Corporation (Redirected from UMC (company))

United Microelectronics Corporation
Native name
聯華電子
Company typePublic
TWSE: 2303
NYSEUMC
IndustrySemiconductor Foundry
Founded1980; 44 years ago (1980)
FounderRobert Tsao
HeadquartersHsinchu Science Park
Hsinchu, Taiwan
Key people
Stan Hung, Chairman
SC Chien, Co-president
Jason Wang, Co-president
RevenueNT$176.821 billion (2020)
NT$22.007 billion or NT$21.931 billion (2020)
NT$27.18 billion or NT$20.852 billion (2020)
Number of employees
Increase 19,577 (2020)
Websitewww.umc.com/en/home/Index
The Singapore factory and offices of United Microelectronics Corporation

United Microelectronics Corporation (UMC; Chinese: 聯華電子; pinyin: Liánhuá Diànzǐ) is a Taiwanese company based in Hsinchu, Taiwan. It was founded as Taiwan's first semiconductor company in 1980 as a spin-off of the government-sponsored Industrial Technology Research Institute (ITRI).

Overview

UMC is best known for its semiconductor foundry business, manufacturing integrated circuits wafers for fabless semiconductor companies. In this role, UMC is ranked behind competitor TSMC. It has four 300 mm fabs, one in Taiwan, one in Singapore, one in China, and one in Japan.

UMC is listed on the Taiwan Stock Exchange as 2303. UMC has 12 manufacturing facilities worldwide, employing approximately 19,500 people.[citation needed]

UMC is a significant supplier to the automotive industry.

History

  • On May 22, 1980, UMC was spun off from the Industrial Technology Research Institute and was formally established as the first private integrated circuit company in Taiwan.
  • 1983: TMC starts a joint research project with US-based Vitelic.
  • 1985
    • UMC was officially listed on the Taiwan Stock Exchange (code: 2303). It was the first listed semiconductor company in Taiwan. At that time, Morris Chang was its chairman.
    • UMC sets up a subsidiary, Unicorn Microelectronics Corporation (also abbreviated UMC), in Silicon Valley to improve access to technology, signing joint research agreements with Mosel (later Mosel Vitelic) and Quasel.
  • 1995: UMC decided to transform from an IDM company with its own products to a professional pure-play foundry.
  • 1996: Spun off its IC design units to establish MediaTek, Novatek, ITE Technology, Faraday Technology, AMIC Technology, and Davicom.
  • 1999: Fab 12A 12-inch wafer fab in Tainan Science Park was officially established.
  • 2000:
    • Lists on the New York Stock Exchange (code: UMC) as Taiwan's first semiconductor company to do so.
    • Produces the first chips using copper process technology and the first 0.13 micron ICs in the semiconductor industry.
  • 2004: 12-inch wafer fab in Singapore enters mass production.
  • 2008: Listed as a constituent stock on the Dow Jones Sustainability Index (DJSI) for the first time.
  • 2010: 30th anniversary of the company.
  • 2013: Fully acquires "Hejian Technology Wafer Fab" in Suzhou, China.
  • 2015: USCXM 12-inch wafer fab located in Xiamen, Fujian Province, China was officially established.
  • 2017: 28 nm mass production begins at USCXM in Xiamen, China.
  • 2019: Fully acquired Japan-based Mie Fujitsu Semiconductor.
  • 2020: Reached a plea agreement with the U.S. Department of Justice to resolve a 2018 trade secrets case.

U.S. Indictment and guilty plea

The United States Department of Justice indicted UMC and Chinese firm Fujian Jinhua in 2018, alleging that they conspired to steal intellectual property from U.S. company Micron. In October 2020, UMC and the U.S. Department of Justice reached a plea agreement, with UMC pleading guilty to one count of receiving and possessing a stolen trade secret and agreeing to pay a fine of $60 million. UMC’s plea and Plea Agreement resolved the 2018 trade secrets case brought against UMC by the U.S. Department of Justice. As part of the Plea Agreement, DOJ agreed to dismiss the original indictment against UMC, including allegations of conspiracy to commit economic espionage and conspiracy to steal multiple trade secrets from Micron Technology, Inc. (“Micron”), patent-related allegations, and alleged damages and penalties of $400 million USD to $8.75 billion. The one trade secret at issue in the guilty plea and Plea Agreement related to older technology that had been in mass production worldwide for several years. DOJ also dismissed a related civil case against UMC. Aside from the fine amount, UMC has no further financial obligations to DOJ. The Plea Agreement also provides that UMC will cooperate with DOJ and will be subject to a three-year term of non-supervised probation.

Fab list

Semiconductor fabrication plants[failed verification]
Fab Node Location Wafer diameter Wafers per month
WKT 450-350 nm Hsinchu, Taiwan 150 mm 31,000
Fab 8A 500-250 nm Hsinchu, Taiwan 200 mm 67,000
Fab 8C 350-110 nm Hsinchu, Taiwan 200 mm 37,000
Fab 8D 130-90 nm Hsinchu, Taiwan 200 mm 31,000
Fab 8E 500-180 nm Hsinchu, Taiwan 200 mm 37,000
Fab 8F 180-150 nm Hsinchu, Taiwan 200 mm 40,000
Fab 8S 180-110 nm Hsinchu, Taiwan 200 mm 31,000
Fab 8N (He Jian) 500-110 nm Suzhou, China 200 mm 76,000
Fab 12A 130-14 nm Tainan, Taiwan 300 mm 87,000
Fab 12i 130-40 nm Singapore 300 mm 53,000
Fab 12X (United Semiconductor) 40-28 nm Xiamen, China 300 mm 19,000 -> 25,000 (2021)
Fab 12M (USJC, former Fujitsu) 90-40 nm Mie, Japan 300 mm 33,000

Processes

Revenue Breakdown by Geometry
Geometry 3Q21 3Q20 3Q19 3Q18
14 nm and below 0% 0% 0% 5%
14 nm<x<=28 nm 19% 14% 12% 13%
28 nm<x<=40 nm 18% 23% 26% 22%
40 nm<x<=65 nm 19% 19% 14% 12%
65 nm<x<=90 nm 8% 10% 12% 10%
90 nm<x<=0.13 um 12% 11% 11% 11%
0.13 um<x<=0.18 um 13% 13% 13% 14%
0.18 um<x<=0.35 um 8% 8% 9% 10%
0.5 um and above 3% 2% 3% 3%

See also


This page was last updated at 2024-01-27 06:37 UTC. Update now. View original page.

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